Through Silicon Vias: Materials, Models, Design, and Performance

51nePwGp22L._SY291_BO1,204,203,200_QL40_ Author Brajesh Kumar Kaushik, Manoj Kumar Majumder, and Vobulapuram Ramesh Kumar
Isbn 9781498745529
File size 7.73MB
Year 2016
Pages 232
Language English
File format PDF
Category Physics

Book Description:

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

 

 

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